Abstract: Copper Paste Investigation for Hybrid Electronics

 
Hybrid electronics are using silver as printed conductive traces and circuits on a substrate even when copper is available. Copper is cheaper and faster to use than silver. The problem with copper is the requirement of removing an oxidized shell before use. Here we show that using a plasma environment and heat will allow for the removal of the shell. Using copper on a PET substrate requires sintering in a reducing formic acid atmosphere.